POLYIMIDE FILM, POLYIMIDE METAL LAMINATE USING THE SAME AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polyimide metal foil laminate in which adhesion of the metal layer is high and which is suitable for a material for a high-density circuit board. SOLUTION: The polyimide film is characterized by being surface-treated with an aqueous solution containing an alcohol amine and an alkali metal hydroxide. The polyimide metal laminate is obtained by providing the surface of the polyimide film with a thermoplastic polyimide layer and then forming the metal layer on the outside of the thermoplastic polyimide layer. A method for manufacturing the polyimide metal laminate is also provided. COPYRIGHT: (C)2007,JPO&INPIT