| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit wherein a wiring pattern whereby the power-supply terminals of an IC mounting portion of a printed board are connected and another wiring pattern whereby the ground terminals of the IC mounting portion of the printed board are connected do not intersect each other. SOLUTION: In a package 1000 having power-supply terminals 110, 120 and ground terminals 210, 220, with respect to a pair of power-supply terminal 110 and ground terminal 210 and a pair of power-supply terminal 120 and ground terminal 220, the respective pairs are so disposed that they are present respectively on the opposite sides of the package to each other, and further, that the arranging orders of their terminals which are generated in a same direction are made equal to each other. In an IC chip 300, with respect to a pair of pads 11, 21 which are connected respectively with the power-supply 110 and the ground terminal 210 and a pair of pads 12, 22 which are connected respectively with the power-supply 120 and the ground terminal 220, the respective pairs are so disposed that they are present respectively on the opposite sides of the chip to each other, and further, that the arranging orders of their pads which are generated in a same direction are made equal to each other. Consequently, in the same layer of a multilayer wiring board, a first wiring pattern 100 interposed connectively between the power-supply terminals 110, 120 and a second wiring pattern 200 interposed connectively between the ground terminals 210, 220 can be so disposed in parallel with each other that they do not intersect each other. COPYRIGHT: (C)2007,JPO&INPIT
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