| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma treatment method and a plasma treatment device wherein the ring-like base material can be treated uniformly and efficiently. <P>SOLUTION: This method comprises a plurality of plasma treatment heads 21 to 24 having an opening where a plasmatized treated gas flows out, and a rotary table which is opposed to openings of the plasma treatment heads 21 to 24, on which a substrate 2 having a hollow part 2x is placed, and which is rotated and moves relatively to the openings of the plasma treatment heads 21 to 24. In a state that the openings of the plasma treatment heads 21 to 24 are retained at a substantially equal spacing so as to be opposed respectively to a nearly ring-like frame like part 2a of the base material 2 placed on the rotary table, the rotary table is rotated and moves relatively, and the plasmatized treated gas flowing out from the plasma treatment heads 21 to 24 is brought into contact with the frame like part 2a of the base material 2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
