| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide various substrates having good flatness and surface roughness in a high-precision area with the material of itself without providing a coated layer and the like, preferably a substrate for a liquid crystal display, a substrate for an electronic device such as a semiconductor wafer and information recording substrate, and further preferably, a mask substrate for EUV lithography; and a manufacturing method thereof. <P>SOLUTION: The substrate has flatness of less than 230 nmPV and surface roughness in RMS of less than 0.20 nm. The method for polishing the substrate includes (a) a process polishing an object by using a polishing pad comprising at least one layer having compressibility of 5% or below in a base layer of the polishing pad. <P>COPYRIGHT: (C)2007,JPO&INPIT |
