发明名称 |
REPROGRAMMABLE METAL-TO-METAL ANTIFUSE EMPLOYING CARBON-CONTAINING ANTIFUSE MATERIAL |
摘要 |
<p>A reprogrammable metal-to-metal antifuse is disposed between two metal interconnect layers in an integrated circuit. A lower barrier layer is formed from Ti. A lower adhesion-promoting layer is disposed over the lower Ti barrier layer. An antifuse material layer selected from a group comprising at least one of amorphous carbon and amorphous carbon doped with at least one of hydrogen and fluorine is disposed over the lower adhesion-promoting layer. An upper adhesion-promoting layer is disposed over the antifuse material layer. An upper Ti barrier layer is disposed over the upper adhesion-promoting layer.</p> |
申请公布号 |
EP1721338(A2) |
申请公布日期 |
2006.11.15 |
申请号 |
EP20050723572 |
申请日期 |
2005.02.22 |
申请人 |
ACTEL CORPORATION |
发明人 |
ISSAQ, A., FARID;HAWLEY, FRANK;MCCOLLUM, JOHN |
分类号 |
H01L31/0256;H01L23/48;H01L23/525;H01L29/00;H01L31/0312 |
主分类号 |
H01L31/0256 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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