METHOD OF FABRICATING MULTIPLE-LAYER PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a multilayered PCB(Printed Circuit Board) is provided to reduce manufacturing time by manufacturing the multilayered PCB by using a bulk lamination process. Metal films are formed on both surfaces of plural insulation layers(10), such that plural lamination plates are formed. Through-holes are formed to penetrate the respective lamination plates. A conductive paste is condensed inside the respective through-holes, such that a conductive bump(13) is formed. A circuit pattern(14) is formed by etching the respective lamination plates. Then, the lamination plates are pressed against one another. Coating films are formed at both surfaces of the respective lamination plates between the conductive bump forming process and the circuit pattern forming process.