| 摘要 |
PROBLEM TO BE SOLVED: To improve semiconductor productivity without depending on the number of die laminates and damaging the substrate or die circuit. SOLUTION: The die bonding equipment mounts a die 2 with a thermo-compression sheet 1 pasted to the lower side of the die 2 on a substrate 10 or a die 12 on the substrate 10. It has an infrared lamp 30 as the means for heating the thermo-compression sheet 1 from the lower side before mounting the die 2 with a thermo-compression sheet on the substrate 10 or die 12. COPYRIGHT: (C)2005,JPO&NCIPI |
