发明名称 THERMALLY CONDUCTIVE SHEET
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermally conductive sheet which is excellent in a thermal conductivity and an electromagnetic wave interference suppressing effect. <P>SOLUTION: The thermally conductive sheet comprises bond and thermally conductive filler and/or soft magnetic powder, by having the thermal conductivity and the electromagnetic wave interference suppressing effect, and by having a small contact thermal resistance to a smooth surface and an irregular surface. With respect to this sheet, it is preferable that the thermally conductive filler and/or the soft magnetic powder is obtained by blending two sorts which are different within a range where a ratio of a mean particle diameter or a ratio of a mean length concerning the thermally conductive filler and/or the soft magnetic powder is 5:1 to 2:1. It is preferable that a reduction rate (K) of the contact thermal resistance calculated from formula (I) in the figure is 65% or more. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006310812(A) 申请公布日期 2006.11.09
申请号 JP20060085249 申请日期 2006.03.27
申请人 AGARI YASUYUKI;NITTA IND CORP 发明人 AGARI YASUYUKI;YOSHIDA TAKAHIKO;MAEZAWA SHIN
分类号 H05K9/00;H01F1/00;H01L23/373 主分类号 H05K9/00
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