发明名称 THERMOSETTING RESIN COMPOSITION FOR MOLDING MATERIAL, MOLDING MATERIAL USING IT AND MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for a molding material capable of reducing generation of a gas at curing without impairing flowability of the molding material, effectively suppressing generation of gas defect at the inside of the obtained molded article and exhibiting excellent mechanical strength of the molded article. SOLUTION: In the thermoset resin composition for the molding material, a phenol resin (A) comprising a benzylic ether type resol having a weight average molecular weight of 4,000 or less; and a thermoset phenol resin (B) having a weight average molecular weight of 5,000 or more and a solubility to boiled methanol of 70 wt.% or more are formulated as indispensable constitution components. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006307186(A) 申请公布日期 2006.11.09
申请号 JP20060088866 申请日期 2006.03.28
申请人 ASAHI ORGANIC CHEM IND CO LTD 发明人 KANEIWA TOSHIHIKO;OTSUBO NARIMITSU
分类号 C08L61/06;C08J5/04 主分类号 C08L61/06
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