| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat sink for a power module which can realize further improvent in the heat-dissipating performance and further improvement in the on-board properties. <P>SOLUTION: The heat sink for a power module 1 comprises a laminated body 20, a first side plate 30, and a second side plate 40. The laminated body 20 has a plurality of plate-shaped flow path plates 21 where a plurality of trenches 23 are dented in parallel with a flat joining face 22, and the respective flow path plates 21 are laminated by each of the joining faces 22. Accordingly, each of the trenches 23 is formed as a parallel flow path 50 in parallel with a surface side, and also a portion except for each of the trenches 23 out of the respective joining faces 22 is formed as a heat conduction route 70a to each parallel flow path 50 in the laminating direction. The first and second side plates 30, 40 are jointed to side faces 26a, 26b of the laminated body 20 and communicate with each parallel flow path 50. An inflow path 30a is formed to flow a cooling medium into each parallel flow path 50, and an outflow path 40a is formed to flow the cooling medium from each parallel flow path 50. A refrigerant flow path is constituted of the inflow path 30a, each parallel flow path 50 and the outflow path 40a. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
