| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board for multiple patterning securely forming a plated layer of a required thickness even in the wiring board at any locations of a large-sized insulating layer. <P>SOLUTION: A wiring board for multiple patterning having a rectangular plan view is provided with a wiring board collecting region 2 having a surface 4 and a rear face 5 with a plurality of wiring boards 8 juxtaposed along a plane direction, and an ear 3 surrounding the circumference of such wiring board collecting region 2. In the wiring board for multiple patterning 1; a tie bar 9 connecting the electrode for plating 7 formed at the ear 3 and a metal layer for sealing (conductor layer) 11 formed on the surface 4 of a plurality of wiring boards 8 juxtaposed in the wiring board collecting region 2, and connecting each of the metal layers for sealing 11 of the adjacent wiring boards 8 and 8, is formed on the same surface 4 as the surface 4 of the wiring board for multi-cavity molding 1 and the surface 4 with the metal layer for sealing 11 formed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
