| 摘要 |
PROBLEM TO BE SOLVED: To provide a new contact device for IC socket which can stably contact by a simple structure, while reducing the contact pressure with respect to external contacts of an IC package, as much as possible. SOLUTION: When the IC package c mounted on the IC socket a is pressed downward, an external contact c1 contacts an upside terminal part 21 of an upper contact terminal 20, and the upper contact terminal 20 moves downward against the repulsive force of a coil spring 30. Accompanying this, elastic pieces 12, 12 at left side and right side are widened by a tapering contact piece 22 against its own elastic force. At this time, since the elastic pieces 12, 12 at left side and right side tightly pinch the tapering contact piece 22 by the own elastic restoring force, electrical continuity between the upper contact terminal 20 and a lower contact terminal 10 is surely secured. When the force pressing the IC package c downward is released from this state, the upper contact terminal 20 surely moves upward and is restored at an original position by the elastic restoring force of the coil spring 30 and by the closing of the elastic pieces 12, 12 at the left side and the right side due to their elastic restoring force. COPYRIGHT: (C)2007,JPO&INPIT
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