| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and electronic equipment which raise the workability in a manufacturing process, suppress the degradation of package material, possess high reliability, and achieve the miniaturization of a semiconductor package is attained by facilitating the routing of wiring. SOLUTION: A semiconductor package 40 is provided with a first semiconductor device 2, a wiring board 10, a second semiconductor device 1, and wire 5. The first semiconductor device 2 has a main surface 2a. The wiring board 10 is arranged on the main surface 2a of the first semiconductor device 2. The second semiconductor device 1 is arranged reversely on a surface opposite to the surface of the first semiconductor device 2. The wire 5 connects electrically the second semiconductor device 1 and the wiring board 10. COPYRIGHT: (C)2007,JPO&INPIT |
