发明名称 Process and composition for electrochemical mechanical polishing
摘要 Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
申请公布号 US2006249394(A1) 申请公布日期 2006.11.09
申请号 US20050251630 申请日期 2005.10.14
申请人 发明人 JIA RENHE;WANG YOU;WANG ZHIHONG;DIAO JIE;MAO DAXIN;TSAI STAN D.;KARUPPIAH LAKSHMANAN;CHEN LIANG-YUH
分类号 C09K13/00;B23H9/00;C09K13/06;C25F3/00 主分类号 C09K13/00
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