| 摘要 |
<p>A module (100, 200, 300, 400, 500, 600, 900) may be electrically connected to a PCB (18, 918) residing in a device (14) or may be joined to the device (14) to form a portion of the housing (16, 916) of the device (14). The module may include a housing (102, 202, 302, 402, 502, 602) having at least one layer, a surface mountable component, such as a surface mountable acoustic transducer (110, 210, 310, 410, 510, 610, 910) having a connecting surface (114, 214, 314, 414, 514, 614, 914), and at least one acoustic port (124, 224, 324, 424, 524, 624, 924) to couple a surface of the surface mountable acoustic transducer to the exterior of the device (14). The module (100, 200, 300, 400, 500, 600, 900) may further include a secondary mounting structure (654) electrically connected to the connecting surface (114, 214, 314, 414, 514, 614, 914) of the surface mountable acoustic transducer (ilO, 210, 310, 4It), 510, 610, 910). The acoustic port (124, 224, 324, 424, 524, 624, 924) may include a layer of an environmental barrier (450, 550).</p> |
