COMPOSITIONS OF THIN CONDUCTIVE TAPE FOR EMI SHIELDING, METHOD THEREOF AND PRODUCTS MANUFACTURED THEREFROM

摘要

Provided are a conductive tape composition for electromagnetic interference shielding, its preparation method, and a conductive tape for electromagnetic interference shielding using the composition which is improved in the dispersion of a filler, elongation and adhesive strength. The conductive tape composition comprises 62.5-87.5 wt% of a polymer matrix resin; 12.5-37.5 wt% of an organic solvent; 30-50 wt% of a first filler particle to the matrix resin solid content; and 0.1-9 wt% of a second filler particle to the first filler particle. Preferably the polymer matrix resin is at least one selected from the group consisting of an acrylic resin, a urethane resin and an epoxy resin; the organic solvent is at least one selected from the group consisting of butyl cellosolve, toluene, methylethylketone, ethyl acetate and N-methyl-2-pyrrolidone; the first filler particle is a silver-coated copper or a nickel-coated graphite fiber; and the second filler particle is a carbon nanotube or a silver-coated glass bead.