发明名称 |
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE |
摘要 |
A method for manufacturing a semiconductor device is provided to increase channel length and to reduce leakage current by simultaneously etching an oxide layer and a substrate using a recess mask of hole shape without forming a protrusion of horn shape. An isolation layer(12) is formed in a substrate(10) to define an active region. A recess mask(24) of hole shape is formed to expose a desired width of the isolation layer at a minor axis of the active region. A recess groove(26) is formed by etching simultaneously the exposed isolation layer and substrate using the recess mask. A gate insulating layer is formed on the resultant structure. A gate electrode is formed on the gate insulating layer to fill the recess groove.
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申请公布号 |
KR20060114435(A) |
申请公布日期 |
2006.11.06 |
申请号 |
KR20050036372 |
申请日期 |
2005.04.29 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
LEE, HONG GU;HWANG, CHANG YOUN |
分类号 |
H01L21/336 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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