Microsystem component and method for gluing microcomponents to a substrate

摘要

A method for gluing microcomponents to a substrate ( 1 ) during the production of microsystem components includes the steps of applying a reactive or non-reactive hot melt type adhesive ( 5 ) to the microcomponent ( 18 ) and/or the substrate ( 1 ), heating the hot melt type adhesive ( 5 ), and placing the microcomponent ( 18 ) onto the substrate ( 1 ). The hot melt type adhesive ( 5 ) is on the contact surfaces between the microcomponent ( 18 ) and the substrate ( 1 ) during and after gluing.