发明名称 Manufacturing process for transponders
摘要 <p>The mutually non-contacting coupling elements (8) are connected to the conductive surface (7) of a chip (5), extending parallel to the chip plane. The structural height of the coupling elements and the chip is designed such that the elements can be used as dipole antenna with operating frequency of 2.45 GHz or more and can be used as disk capacitor in cooperation with read/write unit. An independent claim is also included for transponder manufacturing method.</p>
申请公布号 EP1136943(B1) 申请公布日期 2006.11.02
申请号 EP20010105893 申请日期 2001.03.09
申请人 PLETTNER, ANDREAS, DR. 发明人 PLETTNER, ANDREAS, DR.
分类号 G06K19/077;H01Q1/22;H01Q1/36;H01Q9/28 主分类号 G06K19/077
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