| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC module and a radio communication medium which allow improvement of the reliability of connection between bumps of an IC chip and lands of a substrate. <P>SOLUTION: The radio communication medium is formed by mounting an LSI 4 on a substrate 6 with a flip chip. Two bumps 10 of the LSI 4 are assigned to each of two lands 8a and 8b for connecting the LSI 4 to an antenna. Adhesive is interposed between the bumps 10 to bond the LSI 4 and the land 8a (8b). <P>COPYRIGHT: (C)2007,JPO&INPIT |
