PREPREG SHEET, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a prepreg sheet and a metal-foil-clad laminate for stably obtaining a high-quality circuit board by stabilizing peel strength between a polymer film and the prepreg sheet, and to provide a method for manufacturing the circuit board obtained by using the same. SOLUTION: The prepreg sheet comprises a fiber sheet and a curable resin composition impregnated in the fiber sheet, wherein a cured product of the curable resin composition has a storage modulus at 20°C of 100-2,000 MPa. COPYRIGHT: (C)2007,JPO&INPIT