| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost bonding equipment with a short cycle time. SOLUTION: In moving a bonding head to a bonding point, the bonding equipment applies the supersonic vibration to a pyramid collet 22 while supplying a negative pressure for sucking a chip 3 into a concave section 32 on the pyramid collet 22. At this time, each side surface 41 of the concave section 32 consists of an inclined face linearly in contact with each side 42 of the chip 3, and a width dimension H between the opposed side surfaces 41, 41 is set to be smaller toward the deeper inner part. This allows the chip 3 to be subject to both a negative pressure supplied to the concave section 32 and a supersonic vibration, thereby being guided to a center position C on the concave section 32 even if it is placed in a state 61 where it is sucked up at a location shifted from the center position C on the concave section 32. As a result, the chip 3 can form a positioned spot 62 settled at a center C, and in a state where it is positioned at the center position C. COPYRIGHT: (C)2007,JPO&INPIT
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