| 摘要 |
An electronic circuit device and a method for manufacturing the same are provided to reduce a cost of a forming die by making a circuit board maintain close adhesion to the forming die within a cavity of the forming die. In an electronic circuit device, a circuit unit(3) is mounted on a circuit board(2). A terminal(5) mounted on the circuit board(2) is connected to the circuit board(2) electrically. A casing is made of a resin. The casing seals a whole of the circuit unit(3), a mounting part(21) of the circuit board(2) where the circuit unit(3) is mounted, and a portion of the terminal(5) by the resin and makes a remaining area of the terminal(5) exposed. And, a rear side of the mounted part(21) of the circuit board(2) is designated as a portion of an outer surface of the casing.
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