| 摘要 |
<p>A bake apparatus is provided to stabilize effectively temperature of a chamber for preventing CD(Critical Dimension) defect by improving tightness between a bake cover and a bake plate. A bake shielding part(104) is installed on a bake plate(100) for baking a semiconductor wafer(W). A first junction part is formed on an upper part of the bake shielding part. A bake cover(102) is installed separately on the upper part of the bake plate. A second junction part corresponding to the first junction part is formed on a lower part of the bake cover to shield the upper part of the bake plate, when combining the bake cover to the bake shielding part.</p> |
