| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting method for positively connecting an electronic component having a bump region to a wiring board having a pad electrode region while ensuring electric conduction between them. <P>SOLUTION: In order to solve the problem, the mounting method positively connects the electronic component 4 with the bump region 5 to the wiring substrate 2 with the pad electrode region 3 while ensuring electric conduction is employed. In the mounting method, the surface of the pad electrode region of the wiring substrate is provided with a roughened surface of 0.1μm or more (Rzjis), a half-cured thermoplastic adhesive resin layer 6 is provided on the roughened surface of the pad electrode region, the bump region of the electronic component and the pad electrode region thereof are superimposed so that they are oppositely arranged and are pressurized, heated and compression-bonded. The roughened surface of the pad electrode region of the wiring board can be obtained by applying etching processing or other processing to the pad electrode. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
