| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for soldering and removing an electronic component which can solder an electronic component as a target to a circuit board and can remove the electronic component from the circuit board, while heating the electronic component selectively and uniformly and suppressing a thermal stress as much as possible. SOLUTION: The apparatus comprises a vacuum bit 12 for sucking an electronic component, a heating means 13 for irradiating the vicinity of the vacuum bit with infrared light, an elevating means 11 for moving up and down the vacuum bit 12 and the heating means 13, a table 3 for holding a circuit board P and moving the board horizontally, a temperature detecting means 16 for detecting the surface temperature of an electronic component D, and infrared light irradiation limiting means 40 dislocated below the heating means 6 for limiting the irradiation of the infrared light on the electron component D and the circuit board P from the heating means 13. COPYRIGHT: (C)2007,JPO&INPIT |
