发明名称 APPARATUS FOR TREATING SUBSTRATES AND METHOD OF TREATING SUBSTRATES
摘要 A substrate processing apparatus is provided to avoid non-uniform treatment of process liquid by eliminating the air bubbles in the process liquid before the process liquid is supplied to a substrate. A dividing body(33) divides the inside of a receptacle body(32) into an introduction part(34) and a liquid storing part(35). Process liquid is supplied to the introduction part. The process liquid supplied to the introduction part overflows into the liquid storing part. An outflow part supplies the process liquid of a predetermined height stored in the liquid storing part to the upper surface of a substrate, formed on the lower wall of the liquid storing part. An exhaust part(41) exhausts the air bubbles floating to the surface of the process liquid to the outside of the receptacle body when the surface of the process liquid supplied to the introduction part increases to almost the same height as the upper part of the dividing part, formed in the upper end of the sidewall of the introduction part. A plurality of nozzle holes are formed on the lower wall of the liquid storing part at regular intervals in a direction crossing the transfer direction of the substrate, making the process liquid stored in the liquid storing part linearly flows out to the upper surface of the substrate.
申请公布号 KR20060110789(A) 申请公布日期 2006.10.25
申请号 KR20060034996 申请日期 2006.04.18
申请人 SHIBAURA MECHATRONICS CORPORATION 发明人 IMAOKA YUICHI;ISO AKINORI
分类号 H01L21/304 主分类号 H01L21/304
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