| 摘要 |
A lead forming apparatus is provided to improve the precision of a lead bending process by restraining the spring back of the lead using an improved bending punch structure composed of a lead bending punch and a lead pressing punch. A lead forming apparatus is used for performing a bending process on a lead(14a,14b). The lead forming apparatus comprises a die unit and a bending punch structure. The die unit(80) includes a die and a punch guide(84). The bending punch structure is composed of a lead bending punch and a lead pressing punch. The lead bending punch(92) is used for bending the lead between the die and the punch guide. The lead pressing punch(93) is used for performing a bending forming process on the bent portion of the lead. |
