| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable semiconductor device and a method for efficiently manufacturing this semiconductor device. <P>SOLUTION: The semiconductor device includes a semiconductor substrate 10; an insulating layer 20 that is provided over the semiconductor substrate 10, and has a groove 22 formed in a second plane on the side opposite to a first plane opposed to the semiconductor substrate 10; and a conductor 30 provided over the insulating layer 20. The conductor 30 includes a wiring 32 so formed that it is in contact with the bottom face 28 and the side faces 29 of the groove 22. <P>COPYRIGHT: (C)2007,JPO&INPIT |
