| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an adhesive for a semiconductor, which can be continuously dispensed at a stable application amount even in small amount jetting, in order to solve the problem, wherein minute bubbles contained in the adhesive for a semiconductor device prevent the adhesive from being jetted or makes the jetting amount of the adhesive that is unstable, in continuous dispensing that uses nozzle for the adhesive for a semiconductor. SOLUTION: The adhesive for a semiconductor device contains (A) a thermosetting resin and (B) a filler, and includes a process of vibration processing a reduced-pressure environment. COPYRIGHT: (C)2007,JPO&INPIT
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