| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a thermoelectric device capable of reducing the heat conduction in the direction perpendicular to the current direction and improving the thermoelectric conversion efficiency, and to provide a thermoelectric device using it. SOLUTION: In the substrate for the thermoelectric device, a compound semiconductor thin film 2 with thickness of≥0.5μm and≤10μm is formed on a porous single-crystal substrate 1 with a thickness of≥1μm and≤1,000μm and a porosity of≥5% and≤95%. Electrodes 3 and an insulating film 4 are formed on the surface of the compound semiconductor thin film 2, and a cooled material 5 is laminated on the insulating film 4. COPYRIGHT: (C)2007,JPO&INPIT
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