| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for sucking to fix a substrate for sucking/fixing the substrate mounted on a table surface to the table surface by negative pressure, which can stably reduce a warp of the substrate while sucked/fixed. <P>SOLUTION: The apparatus for sucking to fix the substrate is constituted of a base 10 and a vacuum pump 20. A plurality of suction holes 13 connected with the pump 20 are provided on the table surface 11 of the base 10 for mounting the substrate H. Communication grooves 14a and 14b for connecting the holes 13 with one another are further provided on the table surface 11. The substrate H mounted on the table surface 11 is sucked/fixed to the surface 11 by the negative pressure of the vacuum pump 20. The presence of the grooves 14a and 14b makes a region of the substrate H to be sucked to the table surface 11 continuous, so that the entire region can come into tight contact with the table surface 11 approximately simultaneously. <P>COPYRIGHT: (C)2007,JPO&INPIT |
