发明名称 Apparatus and method for heating substrate and coating and developing system
摘要 A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.
申请公布号 US2006234178(A1) 申请公布日期 2006.10.19
申请号 US20050205150 申请日期 2005.08.17
申请人 TOKYO ELECTRON LIMITED 发明人 HAYASHI SHINICHI;FUKUOKA TETSUO;ODA TETSUYA;INADOMI HIROAKI
分类号 F27B5/04 主分类号 F27B5/04
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