发明名称 |
Polishing pad and method of fabricating semiconductor substrate using the pad |
摘要 |
It is provided a polishing pad of novel construction capable of controlling actively and efficiently a slurry flow during polishing a surface of a semiconductor substrate, such as a wafer, thus making it possible to precisely and stably performing a desired polishing process. Onto a surface of a pad substrate 12 of synthetic resin material, formed is a groove 16 extending approximately circumferentially. An inner circumferential wall surface 20 and an outer circumferential wall surface 22 are made parallel to each other and slant with respect to a center axis 18 of the pad substrate 12. |
申请公布号 |
US7121938(B2) |
申请公布日期 |
2006.10.17 |
申请号 |
US20040482740 |
申请日期 |
2004.01.05 |
申请人 |
TOHO ENGINEERING KABUSHIKI KAISHA |
发明人 |
SUZUKI TATSUTOSHI |
分类号 |
B24B1/00;B24B37/00;B24B37/04;B24B37/20;B24B37/24;B24B37/26;B24D3/28;B24D11/00;H01L21/302;H01L21/304;H01L21/461 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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