| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for photosemiconductor element encapsulation excellent in both light transmissibility and low stress property and light resistance against short wavelength light (for example, 350-500 nm). <P>SOLUTION: The epoxy resin composition for photosemiconductor element encapsulation contains (A) an epoxy resin, (B) an acid anhydride curing agent and (C) a silicone resin having a siloxane unit expressed by general formula (1): R<SB>m</SB>(OR<SP>1</SP>)<SB>n</SB>SiO<SB>(4-m-n)/2</SB>(R groups are each independently a 1-8C substituted or unsubstituted saturated univalent hydrocarbon group or an aromatic hydrocarbon group; R<SP>1</SP>groups are each independently a hydrogen atom or a 1-6C alkyl group; and m and n are each an integer of 0-3). The silicone resin has at least one hydroxy group or alkoxy group bonded to silicon atom and at least 10 mol% of the univalent hydrocarbon group (R) bonded to silicon atom is a substituted or unsubstituted aromatic hydrocarbon group. <P>COPYRIGHT: (C)2007,JPO&INPIT |
