| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method capable of positively eliminating a foreign matter on the surface of a substrate. SOLUTION: This substrate processing apparatus is provided with a spin chuck 1 for rotating a wafer W while holding it, a processing liquid nozzle 2 for supplying a processing liquid to the wafer W, a scrubbing brush 3 for scrubbing the wafer W, a nozzle transfer mechanism 4 for transferring this scrubbing brush 3, and a standby pot 5. The scrubbing brush 3 is brought into a standby state in the standby pot 5 during standby period when the scrubbing processing is not performed for eliminating a foreign matter on the wafer W by the scrubbing brush 3. An aqueous ammonia as an alkaline liquid is supplied to the standby pot 5, and it is supplied in the form of a liquid or a gas to the surface of the scrubbing brush 3 in a standby state. COPYRIGHT: (C)2007,JPO&INPIT
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