发明名称 |
Epoxy resin composition for semiconductor encapsulating use, and semiconductor device |
摘要 |
There is provided an epoxy resin composition for semiconductor encapsulating use comprising: an epoxy resin (A); a phenol resin (B); a curing accelerator (C); and an inorganic filler (D), wherein the inorganic filler (D) contains a spherical fused silica (d1) which contains: metal or semimetal other than silicon; and/or an inorganic compound comprising the metal or semimetal other than silicon.
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申请公布号 |
US2006228561(A1) |
申请公布日期 |
2006.10.12 |
申请号 |
US20060331425 |
申请日期 |
2006.01.12 |
申请人 |
NAKAMURA ATSUSHI |
发明人 |
NAKAMURA ATSUSHI |
分类号 |
B32B27/38;C08G59/00;C08L63/00;H01L21/56 |
主分类号 |
B32B27/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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