| 摘要 |
PROBLEM TO BE SOLVED: To provide an air chuck capable of melting a solder without a reflow when another electronic part is mounted to a circuit board which has already mounted electronic parts. SOLUTION: In the air chuck 1 for mounting to the circuit board an electronic part 201 which comprises a main body 201a formed in a substantially cuboid shape, and terminals 201b, 201b provided at both ends of this main body 201a apart from each other, the electronic part 201 can be supported by an adsorption pipe 204 adhered closely to an upper face of the main body 201a. The air chuck 1 comprises heat generators 202a, 203a, and contactors 202b, 203b having a heat conductivity coupled to the heat generators 202a, 203a, and each of the terminals 201b, 201b can be increased in temperature by contact of the contactors 202b, 203b. COPYRIGHT: (C)2007,JPO&INPIT
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