| 摘要 |
PROBLEM TO BE SOLVED: To suppress in-plane uniformity caused by substrate treatment using a treatment liquid. SOLUTION: This method includes a substrate rotating process of rotating one substrate held by a spin chuck, a preceding pure water supply process of supplying pure water on the substrate surface rotated by the substrate rotating process, and a chemicals liquid supply process of supplying a chemical liquid on the substrate surface rotated by the substrate rotating process. The proceeding pure water supply process is started prior to the chemicals liquid supply process, and the proceeding pure water supply process is continued even after the chemicals liquid supply process is started. Later, the proceeding pure water supply process is terminated, then, the chemicals liquid supply process is continued, and then, the chemicals liquid supply process is terminated. The following pure water supply process which supplies the pure water to the substrate surface proceeds from a period before the chemicals liquid supply process is terminated. COPYRIGHT: (C)2007,JPO&INPIT
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