发明名称 SURFACE MOUNTING COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable surface mounting component wherein a mounting terminal of a mounting component is positioned after printing of molten solder on a mounting substrate, molten solder immediately under the mounting terminal can be ensured enough even if the mounting terminal is pressurized and mounted, and the mounting component is not likely to fall off from a circuit substrate even if vibration, impact or the like is applied. SOLUTION: The surface mounting component consists of a transformer body 11 with a built-in core with a coil wound thereon, and a mounting terminal 12 led out to an outside from the transformer body 11 and electrically connected to the coil, and is subjected to surface mounting by performing reflow soldering for the mounting terminal 12 to a land 14 of a circuit substrate 13. A connection terminal piece 15 facing the land 14 of the circuit substrate 13 of the mounting terminal 12 is subjected to mountain fold, and a solder storage 16 for storing solder is provided to the lower surface of the connection terminal piece 15. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278663(A) 申请公布日期 2006.10.12
申请号 JP20050094976 申请日期 2005.03.29
申请人 TOKYO COIL ENGINEERING KK 发明人 SUGANUMA MASARU
分类号 H01L21/60;H01F27/06;H01F27/29 主分类号 H01L21/60
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