METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a structure and a method which can transfer an integrated circuit including a TFT to a flexible substrate in a shorter time than in a conventional method and can manufacture a semiconductor device with a high yield at low cost. SOLUTION: Peeling is performed while a peeling layer is exposed to an atmosphere of an etching gas. Alternatively, peeling is performed while the etching gas is blown to the peeling layer in the atmosphere of the etching gas for the peeling layer. Specifically, the etching gas is blown to a portion to be peeled while a layer to be peeled is removed from a substrate. Alternatively, peeling is performed in an etchant for the peeling layer while supplying a fresh etchant to the peeling layer. COPYRIGHT: (C)2007,JPO&INPIT