发明名称 Ball coax interconnect
摘要 A pseudo-coaxial vertical transition ( 10 ) includes a substrate ( 16 ). A bump array is disposed in a substantially concentric bump pattern upon the substrate ( 16 ) for simulating a pseudo-coaxial vertical electromagnetic wave propagation. The bump array is formed from a centrally disposed bump ( 32 ) having a predetermined bump diameter, and a plurality of at least five ground bumps ( 36 ) substantially equi-distant and circularly disposed about the centrally disposed bump ( 32 ). The predetermined bump diameter and a bump spacing of the centrally disposed bump are determined in relation to the plurality of ground bumps and a dielectric constant of air for providing a characteristic impedance.
申请公布号 US2006226928(A1) 申请公布日期 2006.10.12
申请号 US20050101882 申请日期 2005.04.08
申请人 发明人 HENNING LARRY C.;HUGHES LAWRENCE C.JR.;MATTHEWS KAREN I.;NAIR DEEPUKUMAR M.
分类号 H01P5/02;H01P1/00 主分类号 H01P5/02
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