| 摘要 |
PROBLEM TO BE SOLVED: To provide a temperature detection element performing high precision temperature detection under a state mounted on a substrate. SOLUTION: On the surface of a chip thermistor element 2, a first terminal electrode 3, a second terminal electrode 4, and a third terminal electrode 5 formed in high resistance state as compared with the first terminal electrode 3 and the second terminal electrode 4 and capable of being bonded to solder material are provided directly. Consequently, heat is conducted to the thermistor element 2 directly from the third terminal electrode 5 under a state soldered to the substrate and high precision temperature detection can be carried out while ensuring mechanical strength. COPYRIGHT: (C)2007,JPO&INPIT
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