发明名称 Slotted substrates and methods and systems for forming same
摘要 Methods and systems for forming slots in a print head substrate having a thickness defined by opposing first and second surfaces. In one exemplary embodiment, a trench is received in the first surface and extends through less than an entirety of the thickness of the substrate. A plurality of slots extends into the substrate from the second surface and connects with the trench to form a compound slot through the substrate. In this embodiment, the trench is wider at portions proximate to said slots than at portions more distant to said slots.
申请公布号 GB2420529(B) 申请公布日期 2006.10.11
申请号 GB20050024982 申请日期 2003.07.17
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 JEFFREY R POLLARD
分类号 B41J2/05;B41J2/14;B41J2/16 主分类号 B41J2/05
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