| 发明名称 |
WAFER SCALE MOLDING OF PROTECTIVE CAPS |
| 摘要 |
<p>The invention is a method of applying an array (134) of caps to a wafer (144) of semiconductor material which includes a plurality of microfabricated devices (146). The method includes applying the array (134) of first caps substantially simultaneously to one side of the wafer (144), bonding the array (134) of caps to the wafer(144) and then separating the wafer into individual packages (148).</p> |
| 申请公布号 |
EP1356510(A4) |
申请公布日期 |
2006.10.11 |
| 申请号 |
EP20020729352 |
申请日期 |
2002.01.08 |
| 申请人 |
SILVERBROOK RESEARCH PTY. LIMITED |
发明人 |
SILVERBROOK, KIA |
| 分类号 |
H01L23/02;B29C33/38;B29C33/40;B29C35/08;B29C43/36;B29C45/12;B81B7/00;H01L21/00;H01L21/44;H01L21/48;H01L21/50;H01L21/8238;H01L23/10;H01L23/12;(IPC1-7):H01L21/822;H01L23/04 |
主分类号 |
H01L23/02 |
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