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发明名称
MOLD-RELEASE TREATING METHOD OF IMPRINT MOLD FOR PRINTED CIRCUIT BOARD
摘要
申请公布号
KR20060104737(A)
申请公布日期
2006.10.09
申请号
KR20050027124
申请日期
2005.03.31
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
MAENG, IL SANG;HONG, MYEONG HO;LEE, CHOON KEUN;KWAK, JEONG BOK;CHO, JAE CHOON;RA, SEUNG HYUN
分类号
G03F7/42;H05K3/00
主分类号
G03F7/42
代理机构
代理人
主权项
地址
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