ONE-PACK-TYPE RESIN COMPOSITION CURABLE WITH COMBINATION OF LIGHT AND HEAT AND USE OF THE SAME

摘要

A one-pack-type resin composition curable with a combination of light and heat which comprises (1) an epoxy resin, (2) an acrylic ester monomer and/or methacrylic ester monomer or an oligomer thereof, (3) a latent epoxy hardener, (4) a free-radical photopolymerization initiator, and (5) a compound having two or more thiol groups per molecule, characterized by containing the ingredient (5) in an amount of 0.001 to 5.0 parts by weight per 100 parts by weight of this resin composition. The one-pack- type resin composition curable with a combination of light and heat can have excellent curability especially in a light-shielded area. Also provided is a liquid-crystal sealant composition curable with a combination of light and heat which is applicable to the one-drop-fill method, has excellent curability in light-shielded areas and adhesion reliability, especially high-temperature high-humidity adhesion reliability.