| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of suppressing a crack on a joining surface of a metallic seal ring or separation of a metallized layer by easing thermal stress generated on the joining surface of the metallic seal ring in a semiconductor package housing semiconductor components on a dielectric multilayer substrate. SOLUTION: The semiconductor package is provided with: the dielectric multilayer substrate 1 housing a semiconductor component 4; the metallic seal ring 2 joined to the top surface of the dielectric multilayer substrate; and a metallic lid 3 joined to the top surface of the metallic seal ring. The metallic lid forms a plurality of slit-like grooves 5 arranged so as to cross on the external front surface other than the external edge to be joined to the metallic seal ring. COPYRIGHT: (C)2006,JPO&NCIPI |
