Bonding procedure for connecting microwave circuits, involves using bonding wire that has round cross-section, has no loss or low loss, and is covered with electrically non-conductive dielectric

摘要

The method involves using a bonding wire to connect the surfaces of MMIC (monolithic microwave integrated circuit) and a substrate. The bonding wire has a round cross-section and no loss or low loss, and is covered with electrically non-conductive dielectric. An independent claim is included for the low-loss dielectric used in the bonding wire.