发明名称 Apparatus and methods for packaging electronic devices for optical testing
摘要 Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
申请公布号 US2006208753(A1) 申请公布日期 2006.09.21
申请号 US20050085734 申请日期 2005.03.21
申请人 TOSI ALBERTO;STELLARI FRANCO;SONG PEILIN 发明人 TOSI ALBERTO;STELLARI FRANCO;SONG PEILIN
分类号 B60R1/06;G01R31/26 主分类号 B60R1/06
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